Preparation of Metal-Containing Diamond-Like Carbon Films by Magnetron Sputtering and Plasma Source Ion Implantation and Their Properties

Stefan Flege,Wolfgang Ensinger,Andreas Hanauer,Ruriko Hatada,Koumei Baba,Takao Morimura

doi:10.1155/2017/9082164

Abstract

Metal-containing diamond-like carbon (Me-DLC) films were prepared by a combination of plasma source ion implantation (PSII) and reactive magnetron sputtering. Two metals were used that differ in their tendency to form carbide and possess a different sputter yield, that is, Cu with a relatively high sputter yield and Ti with a comparatively low one. The DLC film preparation was based on the hydrocarbon gas ethylene (C2H4). The preparation technique is described and the parameters influencing the metal content within the film are discussed. Film properties that are changed by the metal addition, such as structure, electrical resistivity, and friction coefficient, were evaluated and compared with those of pure DLC films as well as with literature values for Me-DLC films prepared with a different hydrocarbon gas or containing other metals.

Highlights

Diamond-like carbon films offer many advantages such as high hardness and wear resistance, low friction coefficient, low surface roughness, chemical inertness, and optical transparency
Film properties that are changed by the metal addition, such as structure, electrical resistivity, and friction coefficient, were evaluated and compared with those of pure DLC films as well as with literature values for Metal-containing diamond-like carbon (Me-DLC) films prepared with a different hydrocarbon gas or containing other metals
For Ti-DLC films prepared with C2H2 no reduction of the friction coefficient with the addition of Ti was found [29], in contrast to the results reported here

Summary

Introduction

Diamond-like carbon films offer many advantages such as high hardness and wear resistance, low friction coefficient, low surface roughness, chemical inertness, and optical transparency. Disadvantages of DLC are its poor thermal stability [3], high internal stresses which might lead to poor adhesion on some substrates such as steel and copper [4], and an increase of friction coefficient with humidity [5]. Most of those limitations can be circumvented by a modification of the DLC film, that is, by the addition of one or more elements to the film [6]. A pulsed high voltage is used to avoid excessive heating of the substrate

Methods

Results

Conclusion