Abstract
Hollow glass microsphere (HGM) /organic silicon resin composite materials with different quantity of HGM were prepared by in-situ hydrolytic polymerization. The hydrolysis reaction of silicone resin was carried out at the same time with the surface treatment of HGM by the silane coupling agent. It has been found that HGM was treated by silane coupling agent and the silicone resin was hydrolyzed on the surface of HGM. Such in-situ polymerization method solves the poor compatibility between HGM and silicone resin. And then the composite materials were cured by hydrosilylation. The composite material has low dielectric constant (2.40) and good heat resistance. Such new HGM/organic silicone resin composite material is expected to be used for integrated circuit packaging material.
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