Preparation of high thermal stability polysulfone microcapsules containing lubricant oil and its tribological properties of epoxy composites

Abstract

Polysulfone (PSF) microcapsules containing lubricant oil have been successfully prepared using solvent evaporation method. The results show that lubricant oil was successfully encapsulated and the encapsulation capacity of about 56.0 wt.% was achieved. The uniform microcapsules have nearly spherical shape and quite smooth outer surface. The mean diameter is approximately 156 and 169 μm by using different dispersant solutions. The wall material is porous in structure with wall thickness of about 20 μm. The initial decomposition temperature of PSF is 480 °C. It is higher than traditional poly(urea-formaldehyde) (PUF) and poly(melamine-formaldehyde) (PMF) wall materials with 245 °C and 260 °C initial decomposition temperature, respectively. High thermal stability of PSF microcapsules can be considered as additives in high temperature resistant polymer materials. The frictional coefficient and wear rate of epoxy composites decreased significantly by incorporating microcapsules containing lubricant oil into epoxy. When the concentration of microcapsules was 25 wt.%, the frictional coefficient and specific wear rate were reduced by 2.3 and 18.3 times, respectively, as compared to the neat epoxy.