Preparation of high thermal conductivity vat photopolymerization used UV-curable resin synergistically enhanced by silicon nitride and boron nitride

Abstract

Additive manufacturing (3D printing) technologies, especially vat photopolymerization (VPP), provide a cost-effective and efficient approach for the fabrication of heat dissipation devices with complex geometric designs. The incorporation of inorganic thermal conductive fillers into resin matrix is widely recognized as an effective way to enhance thermal conductivity. Notably, the synergistic effect of hybrid fillers can further enhance thermal conductivity. However, the consequent drastic increase in viscosity of the UV-curable resin may decrease the success rate and accuracy of printing on commercial VPP 3D printers. In this work, hexagonal boron nitride (h-BN) platelets and spherical h-BN together with β-Si3N4 are introduced into the UV-curable resin system. Corresponding results proved that h-BN together with β-Si3N4 provide a synergistic effect on the thermal conductivity enhancement compared to the filler in single morphology only. Moreover, owing to the spherical structure, low-viscosity UV-curable resin with high solid content can be prepared. In specific, a thermal conductive polymer composite material with a solid content of 60 wt% is prepared, which exhibits high thermal conductivity (1.42 W/mK), representing an enhancement of up to 610 % compared to neat resin. In subsequent application demonstrations, 3D printed heat dissipation devices with as-prepared resin composite material have been shown to effectively enhance the heat dissipation rate for the heating device.