Abstract
High-density compacts of lead tin telluride with grain sizes,L, in the range 25<L<60 µm, 10<L<25 µm, 5<L<10 µm andL<5 µm and with good mechanical properties have been prepared using a two-stage pressing technique. Preliminary measurements of the thermoelectric transport properties of cold-compacted and hot-pressed material are reported. The lattice thermal conductivity decreases with a reduction in grain size. In the cold-compacted material this reduction more than offsets the accompanying reduction in the electrical power factor and results in a significant improvement in the thermoelectric figure of merit.
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More From: Journal of Materials Science: Materials in Electronics
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