Preparation of h-BN/SiCO ceramic matrix composites with high thermal conductivity and strength by vat photopolymerization 3D printing

Abstract

In order to improve the performance of polymer-derived ceramics and expand its application field, the formulation of the photosensitive resin was further optimized and on the basis of modification, the two-dimensional filler h-BN was introduced in this paper. It was found that both the content of PVSA in the photosensitive resin and the introduction of h-BN had remarkable impacts on the properties of the polymer-derived ceramics. When the h-BN content in the PVSA photosensitive resin was 1 wt%, the bending strength and fracture toughness of the ceramic sample after pyrolysis reached 252.4 ± 12.2 MPa and 2.7 ± 0.2 MPa·m1/2, respectively. With the increase of h-BN content, the thermal conductivity of the composite ceramics increased from 0.44 W·m−1·K−1 to 5.34 W·m−1·K−1. It is concluded that the thermal, electrical, and mechanical properties of precursor ceramics are improved by the introduction of two-dimensional fillers of h-BN.