Abstract
A new way of preparing W–Cu functional gradient materials (FGM) with molten salts electrodeposition is studied. The results show that, with the conditions of current density 70 mA·cm−2, electrodeposition temperature 700 °C and bidirectional pulse electrodepositing for 30 minutes (min), the Cu–Ni gradient layer prepared under this condition is widely used dense and smooth. Fundamental to the preparation of Cu–Ni functional gradient layer, Cu–Ni is used as a cathode to deposit W. Under the current density of 50 mA·cm−2, the time of 20 min, with bidirectional pulse electrodeposition, the Cu+Ni+W gradient layer has uniform composition gradient change and larger thickness. The W–Cu gradient materials prepared in this study have good cohesiveness. The addition of Ni would promote the inter-diffusion of Cu and W, and increase the diffusion coefficient significantly.
Highlights
As it can alleviate the thermal stress caused by the mismatch of the thermal properties of tungsten and copper, W–Cu Functional Gradient Materials (FGM) can obtain better comprehensive properties, such as better mechanical properties, corrosion resistance, and thermal shock resistance
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. As it can alleviate the thermal stress caused by the mismatch of the thermal properties of tungsten and copper, W–Cu FGM can obtain better comprehensive properties, such as better mechanical properties, corrosion resistance, and thermal shock resistance
K Koyama [10] obtained a thickness of 100 μm tungsten deposition coating from KF–B2O3– WO3 molten salt system
Summary
As it can alleviate the thermal stress caused by the mismatch of the thermal properties of tungsten and copper, W–Cu FGM can obtain better comprehensive properties, such as better mechanical properties, corrosion resistance, and thermal shock resistance. There are many methods to prepare the W–Cu composite materials with molten salt electrodeposition. With WF6 as the raw materials, Senderoff [6] studied the theory and process of molten salts electrodeposition of tungsten and obtained a dense tungsten gradient layer with good adhesion. The method of molten salt electrodeposition was applied to prepare W–Cu FGM, where nickel was used as a bridge of connection between tungsten and copper. Cu–Ni gradient materials in the NaCl-KCl-NaF-NiO molten salt system was prepared. The W–Cu FGM was prepared with changes from Cu to (Cu + Ni+ W) to W
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