Abstract

Copper oxide (CuO) is a p-type semiconductor with narrow band-gap of 1.2 eV and is widely used as a photoconductive material, and in gas sensors and heterogeneous catalysts. Various morphologies of CuO, such as rods, wires, ribbons, spheres, and even dandelions have been obtained via different synthesis routes. Hollow microparticle CuO structures are probably of most interest due to their potential applications as catalysts, because of their low densities and large surface areas. Hardand soft-templates are commonly used to fabricate hollow copper oxides structures. Hollow CuO microspheres have been prepared hydrothermally from copper acetate as a precursor, and by a hydrothermal reaction using a coppercomplex, in which hexamethyltriethylenetetramine (HMTA) was used as a complexing reagent. Dandelion-like CuO hollow microparticles were also produced, via a donut-like intermediate assembly that consisted of equatorial stacks of rhombic CuO strips, by hydrothermal reaction between copper nitrate and NaOH. The simplest method of making CuO is by the direct oxidation of copper metal in air. Many research groups have prepared CuO nanowires and nanotubes by oxidizing copper nanowires and foils. However, it is difficult to obtain copper metal microspheres for the preparation of hollow CuO microspheres by direct thermal oxidation. Here, we describe a straightforward method for preparing hollow CuO microspheres with radially projecting surface nanorods via the direct thermal oxidation of copper metal microspheres. The morphologies of CuO microspheres and the mechanism of their formation are discussed.

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