Abstract
Hexagonal boron nitride (h-BN) is often used as a filler in polymer composites due to its good thermal conductivity and insulation properties. However, the compatibility between h-BN and the matrix limits its application areas. To overcome this issue, a combination of mechanical liquid phase exfoliation and chemical interfacial modification was adopted in this work. Polyethyleneimine (PEI) was used as the exfoliation reagent to prepare PEI-functionalized h-BN nanosheets, denoted as PEI@BNNS. Thermoplastic polyurethane (TPU) composites with different contents of h-BN and PEI@BNNS which were recorded as h-BN/TPU and PEI@BNNS/TPU were successfully prepared through a hot-pressing process, respectively. The results show that PEI@BNNS/TPU composites have better in-plane thermal conductivity while maintaining insulation, and with the content of 5 wt% PEI@BNNS, the in-plane thermal conductivity of the PEI@BNNS/TPU composite is up to 0.61 W m−1 K−1, which is three times that of pure TPU (0.22 W m−1 K−1).
Highlights
Electronic components are developing in the direction of high frequency, high speed, high power and high integration
3.1 Characterizations of PEI@BNNS The PEI@BNNS was prepared by sanding milling of Hexagonal boron nitride (h-BN) with PEI as sanding additives, which was illustrated in the Fig. 1a, and the structural changes of h-BN and PEI@BNNS were characterized by FTIR, TG, XRD and XPS
PEI@BNNS starts to degrade at about 300 C and experience major weight loss between 300 C with 600 C while h-BN still has no decomposition at up to 800 C, which was due to the removal of PEI with a gra ing rate of 18.6% on h-BN.[28]
Summary
Electronic components are developing in the direction of high frequency, high speed, high power and high integration. Even so, these will cause the internal heat of the device to accumulate rapidly, which greatly affects the stability and service life of electronic products. These materials have some poor properties such as easy corrosion, easy conductivity and high cost, which limit their development in the elds of electronics.[4,5]
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