Preparation of bimodal-diamond/SiC composite with high thermal conductivity

Abstract

The excellent thermal properties of diamond/SiC composites are mainly attributed to the addition of diamond particles. In order to further increase the diamond content, a novel preparation method was used to regulate the distribution of bimodal diamond particles. Moreover, in order to achieve better performance, the effects of particle size ratios on the properties were studied. The results show that with the increase of small diamond particle size, the bimodal diamond packing will change from unmixing mechanism to mixing mechanism, and the critical ratio (small/large) of entrance for 400 µm diamond particles is between 0.37 and 0.5. When the particle size ratio is 0.25, the thermal conductivity reaches the maximum, reaching 812.27 W/mK (break through 800 W/mK for the first time). In addition, the influence of particle size ratio on coefficient of thermal expansion is also discussed.