Abstract
Antireflective nanometric SiO 2 films were formed on glass substrates by dip coating from a colloidal SiO 2 sol having an average particle size of 9 nm. Withdrawal speed of dip coating was varied between 100 and 200 mm/min with 25 mm increments, and baking temperature of the films was altered between 300 and 550 °C with 50 °C increments. Obtained SiO 2 films were in 80–200 nm thickness range. Film thickness was seen to increase with increasing withdrawal speed and to decrease with increasing baking temperature. A maximum light transmittance of 95% was obtained with 4.5% points increase, from the films which were withdrawn at 100 mm/min and baked at 450 or 500 °C. It was seen from SEM observations that the films exhibited full coverage on glass surface and contained no voids or cracks. Size of SiO 2 particles in the film was seen in the AFM analyses to increase with baking temperature. Sintering of SiO 2 particles appeared to accelerate at temperatures over 450 °C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
