Abstract

The intrinsic high electrical resistivity of diamond-like carbon (DLC) films prevents their use in certain applications. The addition of metal or nitrogen during the preparation of the DLC films leads to a lower resistivity of the films, but it is usually accompanied by several disadvantages, such as a potential contamination risk for surfaces in contact with the film, a limited area that can be coated, deteriorated mechanical properties or low deposition rates of the films. To avoid these problems, DLC films have been prepared by plasma source ion implantation using aniline as a precursor gas, either in pure form or mixed with acetylene. The nitrogen from the precursor aniline is incorporated into the DLC films, leading to a reduced electrical resistivity. Film properties such as hardness, surface roughness and friction coefficient are nearly unchanged as compared to an additionally prepared reference sample, which was deposited using only pure acetylene as precursor gas.

Highlights

  • Diamond-like carbon (DLC) films offer many advantageous properties, such as biocompatibility, a high hardness, a low wear rate and a low friction coefficient [1,2,3]

  • When coating a transport jig, which is used for semiconductor wafers, with a diamond-like carbon (DLC) film, it is essential that no electrostatic charges are present on the jig’s surface since otherwise it will attract dust particles

  • A three-dimensional sample such as a transport jig has to be coated on all sides

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Summary

Introduction

Diamond-like carbon (DLC) films offer many advantageous properties, such as biocompatibility, a high hardness, a low wear rate and a low friction coefficient [1,2,3]. Their electrical resistivity spans a wide range, from 1 to 1014 Ω m [3], with the value depending markedly on the preparation method of the films. Plasma source ion implantation (PSII) is the method of choice for coating samples like this. Apart from the feasibility of conformal coating, other advantages of PSII include a high ion current density, low deposition temperature, easy scale-up for the treatment of large areas and relatively short processing times.

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