Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure

Abstract

We prepared a layered composite material by subjecting a deposition billet of AgNiCu15-5 formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed AgNiCu15-5 strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the AgNiCu15-5 samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance AgNiCu15-5-based electrical contact materials efficiently and economically.