Abstract

AbstractTernary nanocomposites are prepared by blending hydroxyl‐terminated poly ether ether ketone having pendant methyl groups (PEEKMOH) with epoxy resin along with Nanolin DK1, followed by curing with 4,4′‐diamino diphenyl sulphone. Differential scanning calorimetry shows a two‐stage cure behavior indicating the catalytic effect of the primary amine and proton, which are generated by the dissociation of organic modifier. Tensile and flexural moduli are increased while tensile strength and glass transition temperature are decreased with increase in clay concentration. Fracture toughness and strain at break are increased by 59 and 62%, respectively, with 1 phr clay loading. Transition electron microscopy and X‐ray diffraction (XRD) analysis reveal exfoliated morphology for the nanocomposites. Scanning electron micrographs show a decrease in both, domain size as well as inter domain distance of the thermoplastic phase with the addition of clay, indicating the occurrence of gelation before phase separation. Analysis of the fracture surface reveals crack path deflection and ductile fracture behavior, confirming that toughness has been improved with the addition of clay and PEEKMOH. Coefficient of thermal expansion (CTE) of the nanocomposites is decreased up to 3 phr clay loading. Oxygen gas permeability is compared with Bharadwaj's and Neilson's models. A marginal improvement in thermal stability is observed with the addition of clay. Copyright © 2009 John Wiley & Sons, Ltd.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.