Preparation and thermal stability of boron-containing phenolic resin/clay nanocomposites

Abstract

In order to further improve thermal stability of the phenolic resins, we combined boron and clay with phenolic resins to prepare nanocomposites (BH-B, BP-B, and BE-B series). Boron-containing phenolic resin/clay (montmorillonite) nanocomposites were prepared using in situ polymerization of resol-type phenolic resins. Montmorillonite (MMT) was modified by benzyldimethylhexadecylammonium chloride (BH), benzyldimethyphenylammonium chloride (BP), and benzyltriethylammonium chloride (BE). X-ray diffraction measurements and transmission electron microscope (TEM) observations showed that clay platelets were partially exfoliated after complete curing of the phenolic resins. Thermogravimetric analysis showed that thermal decomposition temperatures ( T d) and residual weight at 790 °C of cured boron-containing nanocomposites were much higher than the corresponding nanocomposites without boron. For example, the rise in decomposition temperature of BE-B10% is about 42 °C (from 520 to 566 °C), whereas the increase in char yields is 6.4% (from 66.2% to 72.6%). However, the boron-containing composites were more prone to absorb moisture ( ca. 9–14%) than boron-free ones ( ca. 3–4%), which was attributed to unreacted or partially reacted boric acid during preparation process.