Preparation and Thermal-Physical Properties of Three Dimensional Bicontinuous SiC/Cu-Si Composite

Abstract

A three dimensional (3D) SiC/Cu-Si composite with bicontinuous structure was fabricated by spontaneous infiltration method, using porous recrystallized SiC ceramic with porosity of 37% as 3D network reinforcement and Cu alloy (Cu-18Si) as matrix. The phase composition, microstructure, and thermo-physical properties of the as-prepared 3D-SiC/Cu-Si composite were investigated. The experimental results showed that the Cu-18Si alloy could fully penetrate into the porous SiC ceramic at 1600 °C for 2 h spontaneously. SiC and Cu15Si4 phases were identified in the as-prepared composites. The interfacial bond between SiC and Cu-Si alloy was tightly and no severe interfacial reaction was observed. The thermal conductivity and coefficient of thermal expansion of the as-prepared 3D-SiC/Cu-Si composite were changed from 89.8 to 55 W·m-1·K-1 and 7.512 to 9.64×10-6 °C-1 with the temperature increased from room temperature to 500 °C, respectively.