Preparation and thermal degradation property analysis of the tea-based melamine-modified urea–formaldehyde (TMUF) resin

Abstract

In this work, tea powder was used as a filler to produce low-formaldehyde-emission tea-based melamine-modified urea–formaldehyde resin (TMUF). The thermal stabilities of TMUF and the resin without tea powder (MUF0) were characterized using thermogravimetry. The optimal amount of tea powder m(tea)/m(tea + urea) was equal to 0.15. The formaldehyde emission of the three-layer plywood produced by TMUF was reduced by 75.43%, and the wet bonding strength of the plate was increased by 26.67% as compared with the plywood prepared by MUF0. Compared with MUF0, the thermal degradation peak temperature of TMUF resin was shifted to higher temperature, while the carbon residue was increased. The thermal degradation activation energies of TMUF and MUF0 were similar, while TMUF had a lower pre-exponential A. The Flynn–Wall–Ozawa model-free method is used to estimate various activation energy values at different conversion rates and to predict possible reaction mechanisms. Judging the reaction mechanism according to the slope of the straight line fitted by different models, the best model was based on random nucleation.