Abstract
Cu10Sn3 intermetallic compound (IMC) nanoparticles (NPs) were synthesized by one-step thermal decomposition method with low cost. The in-situ formed metal amide in the presence of LiN(iPr)2 can be reduced and thermally decomposed into metal NPs, and then the Cu10Sn3 NPs were obtained, which have an average diameter of 65 nm and good oxidation resistance. The microstructures and mechanical properties of Cu/Cu10Sn3/Cu joints at different sintering temperatures were investigated. The full-Cu10Sn3 IMC joints show high shear strength of 26.8 MPa after sintering at 300 °C for 20 min, demonstrating its broad potential as an interconnect material for high-temperature power electronics.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
