Abstract
Nanosilver paste, an interconnect solder, is a common choice in the electronic packaging industry; however, higher sintering temperatures and lower sintering strength limit its application. At present, core–shell nanoslurry has been studied and applied to chip interconnection. Based on the mechanism of heterogeneous flocculation, we have developed a new nanosilver wrapped tin paste (Sn@Ag paste), and according to the decomposition temperature of the organic dispersant in the slurry, a corresponding sintering process with a temperature of 300 °C was developed. The Sn@Ag core–shell structure makes Sn have good dispersibility and oxidation resistance, and the sintered product of the slurry is a mixture of a solid solution of Ag and an Ag3Sn phase. Among them, the hard and brittle phase Ag3Sn acts as a dispersion strengthening effect in the Ag matrix phase, and the solid solution of Ag acts as a replacement solid solution strengthening. With the increase of doping Sn content, the sintering strength is significantly improved. When the Sn content is 5%, the joint shear strength reaches the highest value of 55 Mpa, which is higher than the pure nanosilver paste by 10 Mpa. This new nanosilver wrapped tin paste technology has the characteristics of low-temperature sintering and high-temperature service.
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