Abstract
The particulate dispersive strengthened Cu-MoSi2 composites were prepared by a powder metallurgy process with aim to develop novel copper based composites of reasonable strength, high thermal conductivity and low thermal expansion coefficients. Compacted samples were sintered to over 90% of theoretical density. Microstructure of the composites was investigated by SEM while mechanical properties such as tensile strength, elongation and thermal properties such as thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined as a function of the MoSi2 content and the process of fabrication. A comparative analysis of the mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the Cu-MoSi2 composites were discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
