Abstract
In order to obtain polyimide composites with ultra-low dielectric constant, a series of MDA-BAPP-BTDA copolyimides/18-crown ether-6 (CPI/18-CE) supramolecular films with inclusion structure were prepared. The effects of 18-CE on CPI’s thermal, mechanical, dielectric and water absorption properties were investigated. The inclusion rate of 18-CE to CPI backbone was ∼50%. The introduction of 18-CE slightly reduced the thermal properties of CPI/18-CE supramolecular films, but greatly improved their mechanical, dielectric and hydrophobic properties. The tensile strength, young’s modulus and elongation at break of CPI/18-CE supramolecular films were maximally increased by 21.8%, 34.1% and 92.9% respectively. Meanwhile their dielectric constant, dielectric loss and water absorption were as low as 2.10, 0.007 and 0.63%, respectively. In summary, CPI/18-CE supramolecular films possess excellent dielectric properties and broad application prospect in the field of microelectronics.
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