Abstract
Imidazole-containing polyimide/silica(PI/SiO2) hybrid films were prepared from 3,3′,4,4′-biphenyltetra-carboxylic dianhydride(BPDA) and 2,2′-di(p-aminophenyl)-5,5′-bibenzimidazole in N,N-dimethylacetamide(DMAc) by sol-gel method and thermal imidization. The hybrid film with high silica mass fraction up to 40% was transparent. Scanning electron microscope(SEM) and transmission electron microscope(TEM) results of the film indicate a homogeneous dispersion of silica nanoparticles in the polyimide matrix. One hybrid film PI/SiO2 with 15% SiO2 exhibits better mechanical properties with a tensile strength of 222 MPa, an elongation at break of 12%, and a tensile modulus of 5.66 GPa. The reinforced mechanism on mechanical properties was also studied.
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