Abstract
The porous expanded graphite (EG) was metallized by electroless plating to improve the C‒Cu interface bonding, and the copper-plated EG/Cu (EG@Cu/Cu) composites with different EG content (1–4 wt%) were fabricated by spark plasma sintering (SPS). The effects of EG content on the microstructure, physical properties, bending properties, and tribological properties of EG@Cu/Cu composites were studied in detail. The results show that the copper-plated composite powder inherits the worm structure of EG, and forms a dense copper coating with a thickness of 2–5 µm. During electroless plating, the plating solution penetrated into the EG particles and formed a microscopic 3D Cu network. Compared with the composite without copper plating, copper coating effectively improves the interface bonding of C‒Cu. EG@Cu/Cu composites retain the physical and mechanical properties of Cu matrix, and obtains lower friction coefficient and wear rate. The discrete and uniform distribution of EG improves the continuity of Cu matrix. When subjected to friction, the flexible EG could overflow from the surface within 10 min to form a saturated self-lubricating film. EG@Cu/Cu composite with 3 wt% EG has better comprehensive properties, the friction coefficient is 22.9% of pure copper, and the wear mass is 7.9% of pure copper. Abrasive wear is the main friction mechanism of EG@Cu/Cu composites.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
