Preparation and properties of copper matrix composites synergistically strengthened by Al2O3 and CPD

Abstract

The development of copper-based composite materials is increasingly requiring both high electrical conductivity and better mechanical properties. In this paper, a novel copper-based composite was prepared by combining carbonized polymer dot (CPD) with flake copper powder (BMCu) and Al2O3 with molecular-level copper powder (MLCu). The composite obtained good mechanical properties with the yield strength of 157.00 MPa and the tensile strength of 366.14 MPa, which are increased by 17.4% and 25.1% compared with those of pure copper matrix (133.76 MPa and 292.72 MPa). The hardness of the composite is 124.7 HV, 27.4% higher than that of pure copper (97.9 HV), and the conductivity is 93.15% IACS. Besides, the strengthening mechanism of tensile property is also discussed, and the improvement of composite strength is mainly due to the dislocation strengthening. This study provides a new idea for the preparation of copper-based composite materials with high electrical conductivity and mechanical properties.