Preparation and Properties of Composite Dough-modeling Compound Reinforced Ethylene Propylene Diene Terpolymer/Silicon Rubber

Abstract

In this study a new method is applied to prepare a novel composite in the ethylene propylene diene terpolymer (EPDM)/silicon rubber matrix with dough-modeling compound (DMC) reinforcing. The SEM photos show that the interfacial adhesion between DMC, EPDM, and silicon rubber could be enhanced, and the compatibility and covulcanization of DMC/EPDM/silicon rubber composite are good. The influence of the DMC and peroxide on the mechanical properties and heat resistance are studied. The results show that the mechanical properties and heat resistance of the composite are good, when m DMC/m EPD/m silicon rubber is 80/25/75. The heat aging properties of the composite using equivalent dicumyl peroxide (DCP) are better than those using benzoperoxide (BPO), but Shore A hardness and elongation at break do not vary significantly. The integral properties of the DMC reinforced EPDM/silicon rubber composite has advantages over three raw materials.