Preparation and properties of adhesives based on phenolic resin containing lignin micro and nanoparticles: A comparative study

Abstract

This work investigated, for the first time, the role of nanosized lignin (LNP), in comparison with microlignin (LMP), when introduced at two different weight amounts (5% and 10 wt%) in bulk phenol–formaldehyde resol as adhesive. Morphological analysis was performed to check out the dispersion and interfacial bonding of lignin in the phenolic resin. The curing process has been examined by differential scanning calorimetry (DSC), while the thermal stability of the composites has been evaluated by using thermogravimetric (TGA) and thermo-mechanical (TMA) analysis. Results exhibited that small amount of lignin could both favor the thermal cure reaction, due to its abundance of phenylpropane units, and the initial thermal resistance could be consequently improved, especially when the nano-sized lignin was used. Meanwhile, the effect of micro- and nano-modification on tensile shear strength of wood lap joints based on lignin-phenol–formaldehyde resol adhesives was also analyzed. Results showed that 5 wt% of LNP could positively increase the shear strength from 8.7 to 10.9 MPa, opening the possibility of using environmental friendly nanoscale lignin in cross linked traditional phenol wood adhesives with enhanced adhesion performance, strongly related to nanoparticles higher specific surface area and reactivity.