Abstract
AbstractA novel polytriazole resin prepared from p‐xylylene diazide (XDA) and N,N,N′,N′‐tetrapropargyl‐p,p′‐diaminodiphenylmethane (TPDDM) was synthesized and characterized. The resin is soluble in common solvents like acetone. The results show that the polytriazole resin can be cured at 70°C. The glass transition temperature and thermal decomposition temperature of the cured resin are 218 and 350°C, respectively. The tensile and flexural strengths of the cured resin achieve 99.0 and 200 MPa, respectively. It is potential as a low cost and easy processing thermal resistant polymer matrix for advanced composite applications. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1038–1042, 2007
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