Abstract
AbstractA novel high‐performance resin system with low injection temperature for resin transfer moulding, M4506, was developed, which was made of 4,4′‐bismaleimidodiphenylmethane, o,o′‐diallyl bisphenol A, o,o′‐diallyl bisphenol A ether, and 1,1′‐bis(4‐cyanatophenyl)ethane. The processing characteristics, thermal and mechanical properties of the system were studied, and the effect of differing stoichiometries of each component on the processing and performance parameters was discussed. Investigations show that the processing properties of the M4506 system are greatly dependent on the stoichiometries of each component in the formulations, while all the three formulations developed in this paper have good processing characteristics, their suitable injection temperature are between 40 and 50 °C, depending on their respective formulation. The three formulations exhibited outstanding heat resistance (Tg = 294–300 °C) and thermal stability, good toughness and high strength, evidence that the M4506 system is a potential candidate as a high‐performance RTM matrix for advance composites as well as high‐performance paints with no solvents. Copyright © 2004 Society of Chemical Industry
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