Abstract
Chemical mechanical polishing (CMP) based on magnetorheological elastomer (MRE) polishing pad can achieve flexible mechanical removal by regulating the magneto-mechanical properties of the MRE polishing pad. In this study, a microporous MRE polishing pad was prepared using a solid-state microcellular foaming process, and the effects of foaming temperature, curing magnetic field strength, and thermal expansion microspheres (TEM) addition content on the properties of the microporous MRE were investigated. The results indicate that a foaming temperature of 115°C produces better foaming effects, an increase in curing magnetic field strength significantly enlarges the size of micropores in the MRE, and with an increase in microsphere content, the porosity of the MRE increases. Polishing single crystal SiC with MRE polishing pads containing different TEM contents revealed that a TEM content of 1 phr had the highest material removal rate (MRR) of 1252 nm/h and the lowest surface roughness of Ra 1.28 nm.
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