Abstract
Carbon/carbon(C/C) composites were bonded with a phosphate adhesive prepared from H3PO4 (orthophosphoric acid) and Al(OH)3 as the matrix and Si and CuO as the inorganic fillers. The mechanical properties were tested at room temperature after the bonded specimens were treated from RT to 1500°C. The results showed that the addition of CuO could greatly improve the adhesive's mechanical properties due to the formation of CunSi (copper silicides). The shear strength of bonded specimens could be up to 8.2 MPa without heat treatment and remain above 2 MPa within the whole heat‐treatment temperature range.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Applied Ceramic Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
