Preparation and performance of high entropy alloy reinforced Cu-based bond diamond tool

Abstract

The research on the influence of hot-press sintering on the properties of AlFeCrCoNi high-entropy alloy powders reinforced copper (HEA/Cu) alloys and the application of HEA/Cu alloys in diamond tools is still limited. Therefore, a new metal bond based on hot-press sintered HEA/Cu alloy for the diamond tool is proposed in this paper. The effect of adding HEA powder on the microstructure, mechanical, and tribological properties of the HEA/Cu alloy is investigated. A metal bond diamond tool based on the HEA/Cu alloy is prepared by hot-press sintering, and its grinding performance on alumina ceramic is examined. The results show that mutual element diffusion occurs between the HEA and Cu matrix during sintering, densifying the HEA/Cu alloys. The Cu alloy presents a higher hardness, yield strength, and wear resistance with a higher content of HEA powder. The hardness, yield strength, and wear resistance of Cu alloy are increased by 53.4%, 332%, and 200%, respectively, with the addition of 20 wt% HEA powders. The HEA/Cu bond diamond tool presents grinding forces and surface roughness equal to those of a commercial Cu-based alloy bond diamond tool.