Abstract
Abstract Adipic acid dihydrazide (ADH) was used to cross-link carboxymethyl chitosan (CMCS) microspheres for Cu 2+ removal from aqueous solution. SEM, FTIR, XPS and BET techniques were performed to characterize the ADH cross-linked CMCS (ADH-CMCS) microspheres. The effects on adsorption capacities of pH value, adsorption time, and initial Cu 2+ concentration were investigated. The adsorption experiments demonstrated ADH-CMCS microspheres had high adsorption capacity for Cu 2+ removal. Furthermore, in order to investigate the effect of ADH in ADH-CMCS microspheres on Cu 2+ adsorption, cross-linking experiments and XPS tests were carried out to reveal the adsorption mechanism. The results suggested that ADH in ADH-CMCS microspheres had a compensation action on its consumption of binding sites for Cu 2+ adsorption. The XPS etching results showed cross-linking reaction occurred mainly on the surfaces of the microspheres. The kinetics of Cu 2+ adsorption on ADH-CMCS microspheres complied with the pseudo-second-order model, indicating a chemical reaction process. The adsorption data analysis using three different adsorption isotherm models indicated that ADH-CMCS microspheres were of heterogeneity surfaces. Moreover, the ADH-CMCS microspheres still exhibited good adsorption performances after the fifth adsorption-desorption cycle.
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More From: Colloids and Surfaces A: Physicochemical and Engineering Aspects
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