Abstract

Abstract Dense and crack-free aluminum oxide films were fabricated by sol–gel spin-coating technology. Aluminum nitrate (Al(NO 3 ) 3 .9H 2 O) was used as the precursor material. X-ray diffraction shows that the fabricated films are amorphous. X-ray photoelectron spectroscopy confirms that the thin films are alumina (Al 2 O 3 ). Field-emission scanning electron microscopy images of the films reveal that the films are compact with a dense cross section. Dielectric measurements were carried out on samples with a metal–insulator–metal structure. The electrical characteristics of the films were affected by the thermal sintering temperature of the films. The leakage current density of the films decreases with the increase in the sintering temperature and increases with the increase in the measuring temperature. The leakage current shows a linear dependence on the voltage in the low-electric field-regime. The current density ascends to higher values due to the effect of space charges in the high-electric-field regime. The ionization energy of the top-electrode metals (Au, Pt or Ti–Au) has a strong effect on the leakage current.

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