Preparation and characterization of silica/polyimide nanocomposite films based on water‐soluble poly(amic acid) ammonium salt

Abstract

In this article, a series of new silica/polyimide (SiO2/PI) nanocomposite films with high dielectric constant (>4.0), low dielectric loss (<0.0325), high breakdown strength (288.8 kV mm−1), and high volume resistivity (2.498 × 1014 Ω m) were prepared by the hydrolysis of tetraethyl orthosilicate in water‐soluble poly(amic acid) ammonium salt (PAAS). The chemical structure of nanocomposite films compared with the traditional pure PI was confirmed by Fourier transform infrared spectroscopy and X‐ray diffraction patterns. The results indicated that both the PAAS and the polyamide acid (PAA) material were effectively converted into the corresponding PI material through the thermal imidization and the amorphous SiO2 was embedded in the nanocomposite films without structural changes. Thermal stability of the nanocomposite films was increased though mechanical property was generally decreased with increasing the mass fraction of SiO2. All the nanocomposite films exhibited an almost single‐step thermal decomposition behavior and the average decomposition temperature was about 615°C. It was concluded that the effective dispersion of SiO2 particles in PI matrix vigorously improved the comprehensive performance of the SiO2/PI nanocomposite films and expanded their applications in the electronic and environment‐friendly industries. POLYM. COMPOS., 38:774–781, 2017. © 2015 Society of Plastics Engineers