Abstract
Fluorocarbon films have been deposited by soft X-ray ablation of polytetrafluoroethylene (PTFE) and characterized as low-dielectric-constant interlayer dielectrics. Very rapid deposition of such films at about 1500 nm/min could be achieved at room temperature, and the dielectric constant of the deposited films is about 2.1. Fourier transform infrared spectroscopy (FT-IR) measurement results suggest that the deposited films are formed primarily as one-dimensional chains of (–CF2–)n which are cross-linked partially. The cross-link density increases with increasing deposition temperature, and their thermal stability improves. However, the dielectric constant of the films increased abruptly above 300°C.
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