Abstract
We prepared iron–nickel–boron (Fe–Ni–B) alloy thin films using the electroless plating method. Their stress generation, thermal-stress, thermal-expansion, and crystal structure were evaluated. Changes in the coefficients of thermal expansion (CTEs), related to the crystal structure, depended on the Fe / Ni ratio in the obtained films, and the microstructure and grain size differed depending on the boron content. The microstructures and grain sizes affected the stress generated by film formation. In addition, the CTE values and change of crystal structure upon heating affected the thermal stress. These Fe–Ni–B alloy films in the Invar composition range with 55–63 wt% Fe contents showed lower CTE values and initial internal stress than those of Ni-rich Fe–Ni–B alloy films, and no structural change upon heating. Thus, an electroless deposited Invar Fe–Ni–B alloy film can be used as metallized films with high thermal suitability for reliable high-density packaging.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.