Abstract

This research explores the integration of corn husk nanocellulose (CHNc) and pineapple leaf nanocellulose (PLNc) as reinforcing agents in a carboxymethyl cellulose-based film derived from durian husk (CMCDH). Through a solvent-casting method, composite films were fabricated with varying nanocellulose contents (15, 30, and 45 wt%). Analysis using Fourier transform infrared spectroscopy and x-ray diffraction confirmed the effectiveness of alkaline and bleaching treatments in eliminating noncellulosic components. Transmission electron microscopy image revealed the rod-like morphology of CHNc and PLNc, with dimensions approximately 206.5 × 7.2 nm and 150.7 × 6.5 nm, respectively. The inclusion of nanocellulose decreased the transparency of CMCDH films while enhancing their tensile strength, thermal stability, and water vapor transmission rate. Notably, CMCDH/PLNc(30%) exhibited the highest tensile strength at 5.06 ± 0.83 MPa, representing a remarkable 220% increase compared to CMCDH biofilm. Thermogravimetric analysis and differential scanning calorimeter results indicated that nanocellulose incorporation delayed the film's decomposition temperature by approximately 10°C. Moreover, CMCDH/PLNc(30%) demonstrated the lowest water vapor transmission rate, marking a 20% improvement. However, the film's properties were compromised at the highest nanocellulose content (45 wt%) due to observed fiber aggregation, as revealed by scanning electron microscopy analysis.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.