Abstract
AbstractCopper films were prepared at room temperature under a Cu(hfac)2-Ar-H2 atmosphere in order toobtain metallized plastics by using ECR-MOCVD (Electron Cyclotron Resonance Metal OrganicChemical Vapor Deposition) coupled with a DC bias system. Structural analysis of the films byECR showed that fine copper grains were embedded in an amorphous plastic matrix with goodadherence. Considering the AES result of the film prepared by ECR-CVD, we construe that thecopper film is chemically bonded with a plastic substrate. The delamination force determined bythe nano-scratch tester® showed in the range from 10 to 20mN.
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