Abstract

PFIX is a pixel architecture designed for colliding-beam experiments at the Tevatron. Its most important application to date is the BTeV experiment. PreFPIX2 is a chip designed to test the FPIX Core, i.e., the pixel control and readout architecture. This FPIX Core will be mated to a periphery specific to a particular experiment. Earlier plans called for the BTeV FPIX chip to be designed in a rad-hard process. However, deep-submicron CMOS processes have demonstrated appropriate radiation tolerance at a lower cost and with greater reliability. Therefore, PreFPIX2 has been fabricated in a 0.25 micrometer process utilizing radiation tolerant design techniques. The architecture has undergone substantial development from earlier versions of FPIX. Most notable are the improvements to the column token passing scheme and to the end-of-column logic. Extensive simulations were performed using both SPICE and structural-level Verilog. Monte Carlo physics simulations of the BTeV pixel detector at half, full and double the planned luminosity were converted to Verilog compatible input files for the chip simulations, allowing the designers to observe the chip operating under real conditions and for extended periods of time. Analyzes of the results reveal that at all luminosities the FPIX Core correctly identifies better than 99.6% of input hits. Bench tests of fabricated chips confirm the accuracy of the simulations.

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