Preface

Abstract

This issue of the Journal of Physics: Conference Series (JPCS) presents the proceedings of the highly successful 1st International Conference on Electronic and Computer Engineering (ECE2023). The conference took place virtually from 4th to 5th July 2023, attracting more than 60 participants from both local and international communities.The electronic and computer engineering Division, Faculty of Electrical Engineering, Universiti Teknologi Malaysia, organized the ECE2023 with the aim of creating a platform for researchers from industry and academia worldwide to converge and explore emerging issues and trends in electronics and computer engineering. This conference facilitated the exchange of research findings, valuable experiences, and the establishment of research collaborations on a global scale.ECE2023 focused on four main tracks to address cutting-edge developments in the field:• Biosensors, Biosignals, and Biomedical Imaging• Machine Learning and Pattern Recognition• Nanotechnology and Advanced Materials• VLSI & Computer ArchitectureEminent figures from academia and industry were invited to deliver keynote speeches that provided valuable insights into the research areas covered by the conference.Each submitted paper underwent a rigorous and comprehensive peer-review process to ensure high-quality technical content and effective presentation. This meticulous evaluation guaranteed that only top-tier papers were selected for presentation during the conference. Acknowledging excellence, the ECE2023 conference awarded the best papers and presenters for each of the four tracks. This recognition aimed to encourage further advancements in the field and acknowledge outstanding contributions.The ECE2023 organizing committee extends heartfelt gratitude to all the speakers, reviewers, and participants whose contributions and enthusiasm contributed to the resounding success of this conference. Additionally, special appreciation is extended to the Journal of Physics: Conference Series (JPCS) for providing a robust platform for publishing the conference proceedings. Collaborating with all involved has been an absolute pleasure, and the committee eagerly anticipates future opportunities for continued collaboration and growth in Electronic and Computer Engineering.Lis of Organizing Committee, Technical Members, Editorial Board Members are available in this pdf.