Preface

Abstract

This issue of the Journal of Physics: Conference Series (JPCS) contains the proceedings of the 2023 3rd International Conference on Electronics, Circuits and Information Engineering (ECIE 2023). The conference took place in Suzhou, China during January 6th-8th, 2023 (virtual form), with the attendance of about 60 scholars, experts, researchers and scientists in related areas.ECIE 2023 is committed to creating an international cooperation and exchange platform for scientists, engineers, and practitioners in the fields related to electronics, circuits and information engineering to share their latest research and development results, discuss existing problems and challenges, and explore cutting-edge technologies. Everyone interested in these fields were welcomed to join the conference and to give comments and raise questions to the speeches and presentations.The conference agenda covered three parts, including a keynote speech delivered by four sophisticated professors from different countries and regions. Among them, Prof. Valentina E. Balas from Aurel Vlaicu University of Arad, Romania performed a dramatic keynote speech on Challenges in Green Computing Technologies and New AI regulations. The research proposed an interesting and hot topic related to Green Computing. She introduced their new research in de field of nanotechnologies brain-inspired proposed for the next generation of computing technologies and focused on developing very reliable nano-architecture with low power consumption. Also, she discussed sustainability and green computing and introduced the new AI regulations in EU. It was a wonderful opportunity for all the participants to interact with the experts and specialists to get their advice or suggestions. And we are very optimistic that all participants had acquired new ideas and knowledge from this conference to enhance the capability toward electronics, circuits and information engineering.Through a rigorous peer-review process, all the submitted papers were performed double blind review to check their quality of content, level of innovation, significance, originality and legibility. Based on the expertise review comments, some excellent papers were accepted and the corresponding authors were invited to submit their papers for final publication. The accepted papers included topics on: VLSI Design and Fabrication, Semiconductor Devices and Circuits, Parallel and Distributed Computing, test and Reliability, Electromagnetic Compatibility, etc.We would like to extend our sincere acknowledgement to all the keynote speakers, peer reviewers, and all the participants. Our special thanks also go to the Conference Chair and the International Technical Program Committee members for the procedures that lead to the organization of this event, to the members of IOP-JPCS for their patience while waiting for the final versions of the papers, to our colleagues who contributed to its realization.The Committee of ECIE 2023List of Committee member is available in this pdf.