Preface

Abstract

The current volume contains 71 articles presented by participants of the 9th Global Conference on Materials Science and Engineering (CMSE 2020). Given the COVID-19 safety precautions, this annual conference was held in the online mode on November 20-23, 2020, being organized by Bosen Academic Conference Solutions Co. (China) with kind support of Sage Publishing (US) and the Institute of Problems of Strength (Ukraine).The online conference, which covered diverse areas of Materials Science and Engineering and their interdisciplinary applications, was successfully communicated via Microsoft Teams Meeting, attracting over hundred participants from 30 countries, including China, France, India, Japan, Korea, Lithuania, Russia, UK, Ukraine, US, and others.Four keynote reports by the General Chair Prof. Sigitas Tamulevičius (Kaunas, Lithuania), Prof. Setsuhisa Tanabe (Kyoto, Japan), Prof. Jinlian Hu (Hong Kong, China), and Prof. Qixin Guo (Saga, Japan) informed the worldwide audience on their latest up-to-date research works, while 52 oral presentations in five sessions provided vast information and inspired thorough discussions on materials for electronics and optoelectronics, magnetic materials, nanostructured materials, sensors and actuators, microdevices, testing of materials, materials for energy applications and catalysis, metals, ceramics, composites, structural materials, etc. Fourteen participants presented their posters on the conference website, which are open to public for academic exchange and discussions.The innovative 71 articles presented in this volume have been recommended and selected after rigorous double-blind reviews by seasoned experts in related areas. We sincerely hope this volume will be a very useful contribution to the academicians, scientists, researchers and engineers for enlightening new vision of advance research and developments in this scientific field.We are grateful to all guests from all over the world for participating in the conference and sharing their expertise and state-of-the-art scientific findings. We also would like to express our sincere appreciation to our committee members for their continuous efforts in reviewing and selecting the submitted papers for this volume. Special thanks to Sage Publishing (US) for the contribution to the success of this conference.Finally, it is my pleasure to thank the Organizing Committee, especially the Conference Secretaries Ms. Ling Li and Ms. Kelly Feng for the impressive results of the conference.Guest Editor:Dr. Alexander Khotsianovsky,Managing Editor of Strength of MaterialsList of Conference Committee Members are available in this Pdf.