Abstract
Under development at the Microelectronics Center of North Carolina is a high-performance multichip module (MCM) that utilizes 95Pb-5Sn and indium solders. In this article, a rigorous thermal/mechanical analysis is applied to the module, with specific emphasis on the solder joint reliability. The methodology includes mechanical characterization of solder joints, thermal modeling, linear structural modeling, nonlinear thermal stress simulations, and fatigue-life prediction as a function of chip power dissipation. The results of the analysis provide insight toward design optimization and fatigue life acceleration factors that relate laboratory tests to field use conditions.
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