Abstract

Interconnect has become a primary bottleneck in integrated circuit design. As CMOS technology is scaled, it will become increasingly difficult for conventional copper interconnect to satisfy the design requirements of delay, power, bandwidth, and noise. On-chip optical interconnect has been considered as a potential substitute for electrical interconnect in the past two decades. In this paper, predictions of the performance of CMOS compatible optical devices are made based on current state-of-art optical technologies. Electrical and optical interconnects are compared for various design criteria based on these predictions. The critical dimensions beyond which optical interconnect becomes advantageous over electrical interconnect are shown to be approximately one tenth of the chip edge length at the 22 nm technology node.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.