Prediction of technological properties of wheat flour by combination of UV-VIS-NIR spectroscopy and multivariate analysis methods

Abstract

Over the last decades, optical spectroscopy methods that do not require complex sample preparation have been widely used to identify and control the composition of food products. In the present study, the possibility of using UV-VIS-NIR spectroscopy combined with multivariate analysis for grading wheat flour into groups differing in technological properties was analyzed. UV-VIS-NIR spectra contain information on the combination and intensity of absorption bands assigned to functional groups of the composition components and determining the technological properties of wheat flour. The database of UV-VIS-NIR spectra of wheat flour samples differing by technological properties was formed into three groups: the first group — wheat flour samples with good baking properties, the second group — with reduced baking properties, the third group — with low baking properties. The visible range of UV-VIS-NIR diffuse reflectance spectrum was used to calculate the color coordinates in the CIE colorimetric system L*a*b*. The greatest difference among the groups in the color coordinates of the samples was found for the coordinate b*, which is associated with the different content of coloring pigments. The spectra database was used to build a classification model for grading wheat flour into quality groups using a combination of principal component analysis and linear discriminant analysis (PCA-LDA) methods. The achieved results indicate that the classification model built on the training sample is able to distinguish wheat flour spectra by quality groups with an accuracy of 96.49%. The effective- ness of the model is verified using a test set of spectra of wheat flour samples. The present study confirms that the combina- tion of UV-VIS-NIR spectroscopy in conjunction with the PCA-LDA method has significant potential for determining a quality group of wheat flour based on technological properties.