Abstract
Switching current drawn by an integrated circuit (IC) creates dynamic power supply noise on the IC and on the printed circuit board (PCB), which in turn causes jitter in $I$ / $O$ signals and reduces the maximum clock frequency. Predicting power supply noise is challenging due to the complexity of determining the dynamic current drawn by the IC and the impedance of the power delivery network. In this paper, a methodology is developed for predicting dynamic power supply noise on the PCB resulting from logic activity in a field-programmable gate array (FPGA). Time-domain switching currents within the FPGA are found by performing power simulations of the implemented logic over small time intervals. A high-frequency model of the die–package–PCB power delivery network is developed based on the inductance and capacitance of the package and die and a cavity model description of the PCB. The technique is shown to accurately predict noise on the PCB in both the time and frequency domains.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Electromagnetic Compatibility
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
