Abstract

Polymer nanocomposite containing metal nanowires are of an advanced class of conductive material. Here, we employed copper nanowire as a conductive filler in highly flexible EMA/EOC (50/50 wt%) binary blend to fabricate highly conductive, lightweight and flexible conductive polymer composite via solution mixing technique. The newly developed composite gave double percolation conductive network by selective localization of the nanowire in one of the binary phase. High conductivity in the range 102 S/cm was attained beyond percolation which was more than that achieved with most of the carbonaceous filler. This composite finds potential application as EMI shielding material for modern electronic devices and was demonstrated in this study. Absorption driven shielding efficiency of −45 dB was attained with 15 wt % copper nanowire loading.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.