Prediction and prevention of mold compound chipping using empirical and simulation methods

Abstract

The subject of study is a Single Small Outline (SSO) electronic package which is a type of magnetic Hall Effect sensor. This package has two main parts: IC and capacitor; both encapsulated by mold compound. This paper aims to investigate chipping of mold compound at the capacitor and provide alternatives to prevent chipping. Both numerical simulation and empirical methods are used to carry out the investigation. The locations of high stress in the simulation coincide with the location of chipping in the empirical method, hence showing the consistency between simulation and empirical results. To reduce chipping, two operating parameters are changed to observe the effect towards chipping. Both changes are implemented in the simulation and production line. Simulation results show the magnitude of high stress has reduced, and supported by empirical data.