Predicting Component Self-Alignment in Lead-Free Reflow Soldering Technology by Virtue of Force Model

Abstract

Since lead-free soldering is initiated in the electronic industry in 1st of July 2006, studying the behaviour of lead-free solders in depth is more important than ever. Several studies and articles have claimed that lead-free solders do not promote the self-alignment of components, what is in contradiction with the observation of our previous experiments. Dynamic behaviour of SMT (Surface Mount Technology) chip components during lead-free reflow soldering will be demonstrated, especially focusing on movement. A force model will be given whereby component self-alignment can be predicted in the case of using lead-free solder pastes. Experiments have been made by misplacing chip components with different sizes and the results are presented in the paper.