Abstract
An easy-to-apply analytical (“mathematical”) stress model is developed for the prediction of the stresses in, and the bow of, a circular substrate/thin-film structure subjected to a change in temperature. The model can be helpful for stress–strain analyses and physical design of thin film systems fabricated on circular substrates, experiencing thermally induced bending deformations. Structures of this type are widely used in microelectronics and photonics packaging engineering.
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